Page 14 - Spring 2009
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33 J. Citakovic, F. Hovesten, G. Rocca, A. Van Halteren, P. Rombach, L. Stenberg, P. Andreani, and E. Bruun, “A compact CMOS MEMS Microphone with 66dB SNR,” IEEE Intl. Solid- State Circuits Conf., 350–351 (2009).
34 www.pulseeng.com. Last viewed 5/1/2009.
35 J. J. Bernstein, J. T. Borenstein, “A micromachined silicon con-
denser microphone with on-chip amplifier,” Proceedings of the Solid-State Sensor and Actuator Workshop, Hilton Head, 239–243 (1996).
36 M. Pedersen, W. Olthuis, and P. Bergveld, “An integrated silicon capacitive microphone with frequency-modulated digital out- put,” Sensors and Actuators A69, 267–275 (1998).
37 J. J. Neumann and K. J. Gabriel, “A fully-integrated CMOS- MEMS audio microphone,” 12th Intl. Conf. on Solid-State Sensors and Actuators and Microsystems, June 8–12, 2003.
38 J. J. Neumann and K. J. Gabriel, “CMOS-MEMS membrane for audio frequency acoustic actuation,” 14th Intl. Conf. on Micro- Electro-Mechanical-Systems, 236–239, January 21–25 2001.
39 J. W. Weigold, T. J. Brosnihan, J. Bergeron, and X. Zhang, “A MEMS condenser microphone for consumer applications,” Proc. IEEE MEMS ’06, Istanbul, Turkey, 86–89 (2006).
ics,” Acustica 4, 519–532 (1954).
11 H. Sell, “Eine neue Methode zur Umwandlung mechanischer
Schwingungen in elektrische und umgekehrt” (A new method for converting mechanical vibrations into electrical and vice versa), Z. Tech. Phys. 18, 3 (1937).
12 Handbook of Chemistry and Physics, 38th Edition (Chemical Rubber Publishing Company, Cleveland, 1957).
13 Gerhard M. Sessler and James E. West, “Second-order gradient unidirectional microphones utilizing an electret transducer,” J. Acoust. Soc. Am. 58(1), 273–278 (1975).
14 D. Hohm and G. M. Sessler, “An integrated silicon-electret-con- denser microphone” in Proc. 11th International Congress on Acoustics 6, 29–32 (1983).
15 F. Goodenough, “Airbags Boom When IC Accelerometer Sees 50 G,” Electronic Design, 45–56 (August 8, 1991).
16 M. Madou, Fundamentals of Microfabrication, 2nd Edition (CRC Press, Boca Raton, FL, 2002).
17 V. Govindarajan and C. Trimble, “Building Breakthrough Businesses Within Established Organizations,” Harvard Business Review, 60–62 (May 2005).
18 C. Trimble, “Analog Devices Incorporated: Microelectro- mechanical Systems (MEMS),” Tuck School of Business at Dartmouth case study (2002).
19 K. Peterson, “Silicon as a Mechanical Material,” Proc. IEEE 70(5), 450–457 (May 1982).
20 M. Royer, J. O. Holmen, M. A. Wurm, O. S. Aadland, and M. Glenn, “ZnO on Si integrated acoustic sensor,” Sensors and Actuators 4, 357–363 (1983).
21 D. Hohm, G. Sessler, “Kapazitive Wandler auf Siliziumbasis mit Siliziumdioxid-Elektret,” (Silicon-based capacitive transducer with silicon dioxide electret), German Patent DE 3325961 A1, Application (1983).
22 D. Hohm and R. Gerhard-Multhaupt “Silicon-dioxide electret transducer,” J. Acoust. Soc. Am. 75(4), 1297–1298 (1984).
23 P. Murphy, K. Hubschi, N. De. Rooik, and C. Racine, “Subminiature Silicon Integrated Electret Capacitor Microphone,” IEEE Trans. on Electrical Insulation 24(3), 495–498 (1989).
24 D. Hohm and G. Hess, “A subminiature condenser microphone with silicon nitride membrane and silicon back plate,” J. Acoust. Soc. Am. 85(1), 476–480 (1989).
25 G. Sessler, “Silicon Microphones,” J. Audio Eng. Soc. 44(1/2), 16–21 (1996).
26 J. Bergqvist and F. Rudolf, “A new condenser microphone in sil- icon,” Sensors and Actuators A21-23, 123–125 (1990)
27 P. R. Scheeper, A. G. H. van der Donk, W. Olthuis, and P. Bergveld, “Fabrication of silicon condenser microphones using single wafer technology,” J. of Microelectromechanical Sys. 1(3), 147–154 (1992).
28 P. R. Scheeper, A. G. H. van der Donk, W. Olthuis, and P. Bergveld, “A review of silicon microphones,” Sensors and Actuators A44, 1–11 (1994).
29 P. Loeppert and Sung B. Lee, “SiSonicTM–The first commercial- ized MEMS microphone,” Solid-State Sensors, Actuators and Microsystems Workshop, Hilton Head, June 4–8, 2006.
30 “Talking Point–Making Money in MEMS,” epn-online http://www.epn-online.com/page/new59003/talking-point- making-money-in-mems.html (2009). Last viewed 5/1/2009.
31 “Knowles ships 300 millionth MEMS microphone,” Small Times, Smalltimes.com http://www.smalltimes.com/articles/article_ display.cfm?Section=ARCHI&C=Elect&ARTICLE_ID=277301 &p=109 (2006). Last viewed 5/1/2009.
32 J. Philipsen, “MEMS microphones for high-volume applica- tions,”1st Euripides Forum, June 28–29 (2007).
Kieran Harney, a product line manager in the Micromachined Products Division of Analog Devices Inc. (ADI), is focused on the development of new MEMS technologies. He joined ADI 22 years ago as a semiconductor packaging engineer in Limerick, Ireland; served as assembly and test manager in the Philippines from 1994 to 1997; and assumed
responsibility for assembly, test, and advanced package devel- opment in Cambridge, MA, in 1997. Kieran received a man- ufacturing engineering degree in 1983 and an MBA in 1993, both from the University of Limerick, Ireland.
Gary W. Elko was born in
Philadelphia, PA in 1955. He
graduated from Cornell
University with a BSEE degree in
1977. He then followed his inter-
ests in acoustics and signal pro-
cessing and received M.S. and
Ph.D. degrees from Penn State
University in 1984. After gradua-
tion, he joined the Acoustics
Research Department at AT&T
Bell Laboratories where he worked on electroacoustic sys- tems and signal processing for hands-free audio communica- tion and room acoustics. He is president of mh acoustic LLC, a company he founded in 2001 along with former Bell Labs colleagues in Summit, NJ. He has over 25 patents and patent applications and has published more than 60 papers. He is a past associate editor of the Institute of Electrical and Electronics Engineers (IEEE) Transactions on Acoustics, Speech and Signal Processing and is a Fellow of the Acoustical Society of America and the IEEE.
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